Technological Equipment

• Clean room class 10000 equipped with advanced technology for integrated circuit processing.
• Laminar flow benches (class 100).
• Photolitography.
• Electron beam lithography (direct writing mask making facilities).
• Reactive ion etching.
• Printed circuit board design.
• High vacuum and UHV Electron gun metal evaporator.
• Sputtering system.
• Annealing and oxidation furnaces.
• Electron cyclotron resonance system for deposition (SiO2, Si3N4, amorphous Si, SiC, etc.) and etching.
• Ion implantation system.
• Rapid thermal annealing and chemical vapor deposition of polysilicon.
• Electron beam annealing system.
• Excimer laser.
• Cutting and microwelding equipments.
• PC's and workstations for integrated circuit design.